Precision cutting >> Diamond Wafering Blade 5" - LAPMASTER
Diamond Wafering Blade 5" - LAPMASTER
Código: OC19High-concentration (15HC) or low-concentration (15LC), double-sided wafering blade for precision sample cutting.
Attachable to most cutting machines available on the market.
* Contact us for the Low Concentration Wafering Blade.
Technical features:
- Dimensions: 5” x 0.015” x 0.5” (127 x 0,38 x 12,7 mm)
- Brand: Lapmaster
